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JAI AMBAY ETCHING SOLUTION

6488C6XB6GPD9K888233 The LEI code is active
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Company Information

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General information

Company name
JAI AMBAY ETCHING SOLUTION
Registry code
UDYAM-DL-06-0044504
Registry status
ACTIVE
Company type
Sole Proprietorship

LEI Code information

LEI Code
6488C6XB6GPD9K888233
Registrar
Udyam Registration
LEI status
ISSUED
Date of issue
30/09/25
Next update
29/09/26
LOU
Nasdaq CSD SE
ROC Policy Conformity Flag
CONFORMING

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Legal Address

Address
M-166, SEC-1, BAWANA DSIIDC INDL. AREA
Postcode
110039
City/Parish
DELHI
Country
India

Head office address

Address
Ground Floor, Plot No. 166, Pocket M, Sec-1, Bawana DSIDC
Postcode
110039
City/Parish
Delhi
Country
India

History

  • 01/10/25
    Initial:
    Lei code: 6488C6XB6GPD9K888233
    (primary) legal name: JAI AMBAY ETCHING SOLUTION
    Language of (primary) legal name: en
    Language of other entity name: en
    Type of other entity name: TRADING_OR_OPERATING_NAME
    Language of legal address: en
    First legal address line: M-166, SEC-1, BAWANA DSIIDC INDL. AREA
    Legal address city: DELHI
    Legal address country: IN
    Legal address postal code: 110039
    Language of headquarters address: en
    First headquarters address line: Ground Floor, Plot No. 166, Pocket M, Sec-1
    Additional headquarters address line: Bawana DSIDC
    Headquarters address city: Delhi
    Headquarters address country: IN
    Headquarters address postal code: 110039
    Registered at: RA000900
    Registered as: UDYAM-DL-06-0044504
    Jurisdiction of formation: IN
    General category: SOLE_PROPRIETOR
    Entity legal form code: 4QIE
    Entity status: ACTIVE
    Registration date: 30/09/25
    Last update: 30/09/25
    Status: ISSUED
    Next renewal: 29/09/26
    Lei issuer: 485100001PLJJ09NZT59
    Corroboration level: FULLY_CORROBORATED
    Data validated at (id): RA000900
    Data validated as: UDYAM-DL-06-0044504